Report Summary
Eternity Insights has published a new study on Global BGA Solder Spheres Market focusing on key segments as by Type (Lead Solder Spheres, Lead Free Solder Spheres, Other), by Application (BGA, CSP & WLCSP, Flip-Chip & Others), and by region. This deep dive re-search report highlights the market and competitive intelligence across the key segments of the mar-ket. The report also considers the impact of COVID-19 on the global BGA Solder Spheres Market.
The report considers 2018-2020 as historic period, 2021 as base year, and 2022-2028 as forecast period. The report includes quantitative analysis of the market supported by the market drivers, challenges, and trends to accurately map the market scenario and competition. Moreover, key insights related to market having direct impact on the market will also be covered.
BGA Solder Spheres Market report is based on robust research methodology designed using blend of research ap-proaches developed using secondary/desk research and validated through the primary research and expert insights. Eternity Insights also uses paid data bases such as FACIVA, Hoovers, and other bench-marking and forecasting tools to provide accurate statistical analysis of supply and demand trends.
Global BGA Solder Spheres Market Size, 2018-2028 (USD Million)
To learn more about this report
Global BGA Solder Spheres Market Segmentation:
BGA Solder Spheres Market, By Type
- Lead Solder Spheres
- Lead Free Solder Spheres
- Other
BGA Solder Spheres Market, By Application
- BGA
- CSP & WLCSP
- Flip-Chip & Others
To learn more about this report
Geographically, the market is categorized in to five regions as North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. North America region dominates the global BGA Solder Spheres market in terms of demand generation. The BGA Solder Spheres market in Asia Pacific region is expected to grow at significantly high growth rate. The regional market is further sub-segmented and analyzed at granular level across key countries. The report will include market size and forecast for BGA Solder Spheres market for below listed coun-tries across each region.
North America (U.S. and Canada), Europe (Germany, France, Italy, UK, Spain, and Rest of Europe), Asia Pacific (China, India, Japan, Australia, and Rest of Asia Pacific region); Latin America (Brazil, Mexico, and rest of the Latin America); Middle East and Africa (GCC, South Africa, and Rest of the Middle East and Africa).
Global BGA Solder Spheres Market Taxonomy:
To learn more about this report
Global BGA Solder Spheres Market Competitive Landscape
The global BGA Solder Spheres market analysis report covers detailed analysis of competitive scenario across globe. The report includes profiles of leading players covering below details
- Company Overview
- Financial Analysis
- Product Portfolio Analysis
- Strategic Overview
- SWOT Analysis
List of Companies Profiled in the report:
- Senju Metal
- DS HiMetal
- MKE
- YCTC
- Nippon Micrometal
- Accurus
- PMTC
- Shanghai hiking solder material
- Shenmao Technology
- Other Players of Specific Interest can be added based on requirement
Market Segmentation
Report Attributes |
Details |
The market size value in 2021 |
USD XX.XX Million |
CAGR (2021 - 2028) |
XX.XX % |
The Revenue forecast in 2028 |
USD XX.XX Million |
Base year for estimation |
2021 |
Historical data |
2018-2019 |
Forecast period |
2022-2028 |
Quantitative units |
- Revenue in USD Million
- CAGR from 2021 to 2028
|
Report coverage |
Revenue forecast, company ranking, competitive landscape, growth factors, and trends |
Segments covered |
By Type Outlook, Application Outlook, Regional Outlook |
By Type Outlook |
Lead Solder Spheres, Lead Free Solder Spheres, Other |
By Application Outlook |
BGA, CSP & WLCSP, Flip-Chip & Others |
Regional scope |
North America, Europe, Asia Pacific, Latin America, Middle East & Africa |
Country scope |
U.S., Canada, U.K., Germany, France, BENELUX, China, India, Japan, South Korea, Brazil, Saudi Arabia, UAE, Turkey |
Key companies profiled |
Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology |
Customization Available |
Yes, the report can be tailored to meet your specific requirements. |
Key Benefits to the stake holders
- Qualitative and quantitative analysis of the market based on segmentation involving both economic as well as non-economic factors
- Provision of market value (USD Billion) and volume (Tons) data for each segment and sub-segment
- Indicates the region and segment that is expected to witness the fastest growth as well as to dominate the market
- Analysis by geography highlighting the consumption of the product/service in the region as well as indicating the factors that are affecting the market within each region
- Competitive landscape which incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions and acquisitions in the past five years of companies profiled
- Extensive company profiles comprising of company overview, company insights, product benchmarking and SWOT analysis for the major market players
- The current as well as the future market outlook of the industry with respect to recent developments (which involve growth opportunities and drivers as well as challenges and restraints of both emerging as well as developed regions
- Includes an in-depth analysis of the market of various perspectives through Porter’s five forces analysis
- Provides insight into the market through Value Chain
- Market dynamics scenario, along with growth opportunities of the market in the years to come
Table Of Contents
Table of Contents
Global BGA Solder Spheres Market Research Report 2021-2027, by Manufacturers, Regions, Types and Applications
1 Study Coverage
1.1 BGA Solder Spheres Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
1.4.1 Global BGA Solder Spheres Market Size Growth Rate by Type
1.4.2 Lead Solder Spheres
1.4.3 Lead Free Solder Spheres
1.5 Market by Application
1.5.1 Global BGA Solder Spheres Market Size Growth Rate by Application
1.5.2 BGA
1.5.3 CSP & WLCSP
1.5.4 Flip-Chip & Others
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global BGA Solder Spheres Production
2.1.1 Global BGA Solder Spheres Revenue 2017-2027
2.1.2 Global BGA Solder Spheres Production 2017-2027
2.1.3 Global BGA Solder Spheres Capacity 2017-2027
2.1.4 Global BGA Solder Spheres Marketing Pricing and Trends
2.2 BGA Solder Spheres Growth Rate (CAGR) 2021-2027
2.3 Analysis of Competitive Landscape
2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
2.3.2 Key BGA Solder Spheres Manufacturers
2.4 Market Drivers, Trends and Issues
2.5 Macroscopic Indicator
2.5.1 GDP for Major Regions
2.5.2 Price of Raw Materials in Dollars: Evolution
3 Market Size by Manufacturers
3.1 BGA Solder Spheres Production by Manufacturers
3.1.1 BGA Solder Spheres Production by Manufacturers
3.1.2 BGA Solder Spheres Production Market Share by Manufacturers
3.2 BGA Solder Spheres Revenue by Manufacturers
3.2.1 BGA Solder Spheres Revenue by Manufacturers (2017-2020)
3.2.2 BGA Solder Spheres Revenue Share by Manufacturers (2017-2020)
3.3 BGA Solder Spheres Price by Manufacturers
3.4 Mergers & Acquisitions, Expansion Plans
4 BGA Solder Spheres Production by Regions
4.1 Global BGA Solder Spheres Production by Regions
4.1.1 Global BGA Solder Spheres Production Market Share by Regions
4.1.2 Global BGA Solder Spheres Revenue Market Share by Regions
4.2 United States
4.2.1 United States BGA Solder Spheres Production
4.2.2 United States BGA Solder Spheres Revenue
4.2.3 Key Players in United States
4.2.4 United States BGA Solder Spheres Import & Export
4.3 Europe
4.3.1 Europe BGA Solder Spheres Production
4.3.2 Europe BGA Solder Spheres Revenue
4.3.3 Key Players in Europe
4.3.4 Europe BGA Solder Spheres Import & Export
4.4 China
4.4.1 China BGA Solder Spheres Production
4.4.2 China BGA Solder Spheres Revenue
4.4.3 Key Players in China
4.4.4 China BGA Solder Spheres Import & Export
4.5 Japan
4.5.1 Japan BGA Solder Spheres Production
4.5.2 Japan BGA Solder Spheres Revenue
4.5.3 Key Players in Japan
4.5.4 Japan BGA Solder Spheres Import & Export
4.6 Other Regions
4.6.1 South Korea
4.6.2 India
4.6.3 Southeast Asia
5 BGA Solder Spheres Consumption by Regions
5.1 Global BGA Solder Spheres Consumption by Regions
5.1.1 Global BGA Solder Spheres Consumption by Regions
5.1.2 Global BGA Solder Spheres Consumption Market Share by Regions
5.2 North America
5.2.1 North America BGA Solder Spheres Consumption by Application
5.2.2 North America BGA Solder Spheres Consumption by Countries
5.2.3 United States
5.2.4 Canada
5.2.5 Mexico
5.3 Europe
5.3.1 Europe BGA Solder Spheres Consumption by Application
5.3.2 Europe BGA Solder Spheres Consumption by Countries
5.3.3 Germany
5.3.4 France
5.3.5 UK
5.3.6 Italy
5.3.7 Russia
5.4 Asia Pacific
5.4.1 Asia Pacific BGA Solder Spheres Consumption by Application
5.4.2 Asia Pacific BGA Solder Spheres Consumption by Countries
5.4.3 China
5.4.4 Japan
5.4.5 South Korea
5.4.6 India
5.4.7 Australia
5.4.8 Indonesia
5.4.9 Thailand
5.4.10 Malaysia
5.4.11 Philippines
5.4.12 Vietnam
5.5 Central & South America
5.5.1 Central & South America BGA Solder Spheres Consumption by Application
5.5.2 Central & South America BGA Solder Spheres Consumption by Countries
5.5.3 Brazil
5.6 Middle East and Africa
5.6.1 Middle East and Africa BGA Solder Spheres Consumption by Application
5.6.2 Middle East and Africa BGA Solder Spheres Consumption by Countries
5.6.3 Turkey
5.6.4 GCC Countries
5.6.5 Egypt
5.6.6 South Africa
6 Market Size by Type
6.1 Global BGA Solder Spheres Breakdown Dada by Type
6.2 Global BGA Solder Spheres Revenue by Type
6.3 BGA Solder Spheres Price by Type
7 Market Size by Application
7.1 Overview
7.2 Global BGA Solder Spheres Breakdown Dada by Application
7.2.1 Global BGA Solder Spheres Consumption by Application
7.2.2 Global BGA Solder Spheres Consumption Market Share by Application (2017-2020)
8 Manufacturers Profiles
8.1 Senju Metal
8.1.1 Senju Metal Company Details
8.1.2 Company Description
8.1.3 Capacity, Production and Value of BGA Solder Spheres
8.1.4 BGA Solder Spheres Product Description
8.1.5 SWOT Analysis
8.2 DS HiMetal
8.2.1 DS HiMetal Company Details
8.2.2 Company Description
8.2.3 Capacity, Production and Value of BGA Solder Spheres
8.2.4 BGA Solder Spheres Product Description
8.2.5 SWOT Analysis
8.3 MKE
8.3.1 MKE Company Details
8.3.2 Company Description
8.3.3 Capacity, Production and Value of BGA Solder Spheres
8.3.4 BGA Solder Spheres Product Description
8.3.5 SWOT Analysis
8.4 YCTC
8.4.1 YCTC Company Details
8.4.2 Company Description
8.4.3 Capacity, Production and Value of BGA Solder Spheres
8.4.4 BGA Solder Spheres Product Description
8.4.5 SWOT Analysis
8.5 Nippon Micrometal
8.5.1 Nippon Micrometal Company Details
8.5.2 Company Description
8.5.3 Capacity, Production and Value of BGA Solder Spheres
8.5.4 BGA Solder Spheres Product Description
8.5.5 SWOT Analysis
8.6 Accurus
8.6.1 Accurus Company Details
8.6.2 Company Description
8.6.3 Capacity, Production and Value of BGA Solder Spheres
8.6.4 BGA Solder Spheres Product Description
8.6.5 SWOT Analysis
8.7 PMTC
8.7.1 PMTC Company Details
8.7.2 Company Description
8.7.3 Capacity, Production and Value of BGA Solder Spheres
8.7.4 BGA Solder Spheres Product Description
8.7.5 SWOT Analysis
8.8 Shanghai hiking solder material
8.8.1 Shanghai hiking solder material Company Details
8.8.2 Company Description
8.8.3 Capacity, Production and Value of BGA Solder Spheres
8.8.4 BGA Solder Spheres Product Description
8.8.5 SWOT Analysis
8.9 Shenmao Technology
8.9.1 Shenmao Technology Company Details
8.9.2 Company Description
8.9.3 Capacity, Production and Value of BGA Solder Spheres
8.9.4 BGA Solder Spheres Product Description
8.9.5 SWOT Analysis
9 Production Forecasts
9.1 BGA Solder Spheres Production and Revenue Forecast
9.1.1 Global BGA Solder Spheres Production Forecast 2021-2027
9.1.2 Global BGA Solder Spheres Revenue Forecast 2021-2027
9.2 BGA Solder Spheres Production and Revenue Forecast by Regions
9.2.1 Global BGA Solder Spheres Revenue Forecast by Regions
9.2.2 Global BGA Solder Spheres Production Forecast by Regions
9.3 BGA Solder Spheres Key Producers Forecast
9.3.1 United States
9.3.2 Europe
9.3.3 China
9.3.4 Japan
9.4 Forecast by Type
9.4.1 Global BGA Solder Spheres Production Forecast by Type
9.4.2 Global BGA Solder Spheres Revenue Forecast by Type
10 Consumption Forecast
10.1 Consumption Forecast by Application
10.2 BGA Solder Spheres Consumption Forecast by Regions
10.3 North America Market Consumption Forecast
10.3.1 North America BGA Solder Spheres Consumption Forecast by Countries 2021-2027
10.3.2 United States
10.3.3 Canada
10.3.4 Mexico
10.4 Europe Market Consumption Forecast
10.4.1 Europe BGA Solder Spheres Consumption Forecast by Countries 2021-2027
10.4.2 Germany
10.4.3 France
10.4.4 UK
10.4.5 Italy
10.4.6 Russia
10.5 Asia Pacific Market Consumption Forecast
10.5.1 Asia Pacific BGA Solder Spheres Consumption Forecast by Countries 2021-2027
10.5.2 China
10.5.3 Japan
10.5.4 Korea
10.5.5 India
10.5.6 Australia
10.5.7 Indonesia
10.5.8 Thailand
10.5.9 Malaysia
10.5.10 Philippines
10.5.11 Vietnam
10.6 Central & South America Market Consumption Forecast
10.6.1 Central & South America BGA Solder Spheres Consumption Forecast by Country 2021-2027
10.6.2 Brazil
10.7 Middle East and Africa Market Consumption Forecast
10.7.1 Middle East and Africa BGA Solder Spheres Consumption Forecast by Countries 2021-2027
10.7.2 Middle East and Africa
10.7.3 Turkey
10.7.4 GCC Countries
10.7.5 Egypt
10.7.6 South Africa
11 Upstream, Industry Chain and Downstream Customers Analysis
11.1 Analysis of BGA Solder Spheres Upstream Market
11.1.1 BGA Solder Spheres Key Raw Material
11.1.2 Typical Suppliers of Key BGA Solder Spheres Raw Material
11.1.3 BGA Solder Spheres Raw Material Market Concentration Rate
11.2 BGA Solder Spheres Industry Chain Analysis
11.3 Marketing & Distribution
11.4 BGA Solder Spheres Distributors
11.5 BGA Solder Spheres Customers
12 Opportunities & Challenges, Threat and Affecting Factors
12.1 Market Opportunities
12.2 Market Challenges
12.3 Porter's Five Forces Analysis
13 Key Findings
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer